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| SEMiX353GB176HDs Absolute Maximum Ratings Symbol IGBT VCES IC ICnom ICRM ICRM = 2xICnom VCC = 1000 V VGE 20 V VCES 1700 V VGES tpsc Tj Inverse diode IF Tc = 25 C Tc = 80 C Tj = 125 C Tj = 150 C Tc = 25 C Tc = 80 C 1700 353 251 225 450 -20 ... 20 10 -55 ... 150 428 289 225 IFRM = 2xIFnom tp = 10 ms, sin 180, Tj = 25 C 450 1800 -40 ... 150 600 -40 ... 125 AC sinus 50Hz, t = 1 min 4000 V A A A A V s C A A A A A C A C V Conditions Values Unit SEMiX(R) 3s Trench IGBT Modules SEMiX353GB176HDs Tj = 150 C IFnom Features * Homogeneous Si * Trench = Trenchgate technology * VCE(sat) with positive temperature coefficient * UL recognised file no. E63532 IFRM IFSM Tj Module It(RMS) Tstg Visol Typical Applications* * AC inverter drives * UPS * Electronic welders Characteristics Symbol IGBT VCE(sat) VCE0 rCE VGE(th) ICES Cies Coes Cres QG RGint td(on) tr Eon td(off) tf Eoff Rth(j-c) per IGBT IC = 225 A VGE = 15 V chiplevel Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C VGE = 15 V VGE=VCE, IC = 9 mA VGE = 0 V VCE = 1700 V VCE = 25 V VGE = 0 V VGE = - 8 V...+ 15 V Tj = 25 C VCC = 1200 V IC = 225 A RG on = 5.6 RG off = 5.6 Tj = 125 C Tj = 125 C Tj = 125 C Tj = 125 C Tj = 125 C Tj = 125 C Tj = 25 C Tj = 125 C f = 1 MHz f = 1 MHz f = 1 MHz 19.9 0.83 0.66 2100 2.83 250 75 155 930 180 85 0.086 Tj = 25 C Tj = 125 C 5.2 2 2.45 1 0.9 4.4 6.9 5.8 0.1 2.45 2.9 1.2 1.1 5.6 8.0 6.4 0.3 V V V V m m V mA mA nF nF nF nC ns ns mJ ns ns mJ K/W Conditions min. typ. max. Unit GB (c) by SEMIKRON Rev. 12 - 16.12.2009 1 SEMiX353GB176HDs Characteristics Symbol Conditions Tj = 25 C Tj = 125 C Tj = 25 C Tj = 125 C rF Tj = 25 C Tj = 125 C IF = 225 A Tj = 125 C di/dtoff = 4000 A/s T = 125 C j VGE = -15 V Tj = 125 C VCC = 1200 V per diode 0.9 0.7 2.0 2.7 min. typ. 1.6 1.5 1.1 0.9 2.0 2.7 280 83 45 max. 1.75 1.7 1.3 1.1 2.0 2.7 Unit V V V V m m A C mJ Inverse diode VF = VEC IF = 225 A VGE = 0 V chip VF0 SEMiX(R) 3s Trench IGBT Modules SEMiX353GB176HDs IRRM Qrr Err Rth(j-c) Module LCE RCC'+EE' 0.13 20 K/W nH m m K/W res., terminal-chip per module to heat sink (M5) TC = 25 C TC = 125 C 3 to terminals (M6) 2.5 0.7 1 0.04 5 5 300 Features * Homogeneous Si * Trench = Trenchgate technology * VCE(sat) with positive temperature coefficient * UL recognised file no. E63532 Rth(c-s) Ms Mt w Nm Nm Nm g K Typical Applications* * AC inverter drives * UPS * Electronic welders Temperatur Sensor R100 B100/125 Tc=100C (R25=5 k) R(T)=R100exp[B100/125(1/T-1/T100)]; T[K]; 493 5% 3550 2% GB 2 Rev. 12 - 16.12.2009 (c) by SEMIKRON SEMiX353GB176HDs Fig. 1: Typ. output characteristic, inclusive RCC'+ EE' Fig. 2: Rated current vs. temperature IC = f (TC) Fig. 3: Typ. turn-on /-off energy = f (IC) Fig. 4: Typ. turn-on /-off energy = f (RG) Fig. 5: Typ. transfer characteristic Fig. 6: Typ. gate charge characteristic (c) by SEMIKRON Rev. 12 - 16.12.2009 3 SEMiX353GB176HDs Fig. 7: Typ. switching times vs. IC Fig. 8: Typ. switching times vs. gate resistor RG Fig. 9: Typ. transient thermal impedance Fig. 10: Typ. CAL diode forward charact., incl. RCC'+EE' Fig. 11: Typ. CAL diode peak reverse recovery current Fig. 12: Typ. CAL diode recovery charge 4 Rev. 12 - 16.12.2009 (c) by SEMIKRON SEMiX353GB176HDs SEMiX 3s spring configuration (c) by SEMIKRON Rev. 12 - 16.12.2009 5 SEMiX353GB176HDs This technical information specifies semiconductor devices. No warranty or guarantee expressed or implied is made regarding delivery, performance or suitability. 6 Rev. 12 - 16.12.2009 (c) by SEMIKRON |
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